Authors:
Bram Neirinck (1); Shuigen Huang (2) ; Jozef Vleugels (2); Xiaoshuang Li (1)
1- Aerosint SA, Belgium
2- KU Leuven, Department of Materials Engineering, Belgium
Abstract:
Co-fired devices were developed in the late 50’s as a robust option for high power / high temperature electronics. As the name suggest, they were obtained by simultaneously sintering different materials, often an insulating ceramic substrate with a conductive metal on top. Since these devices were first conceived there have been significant developments in processing and sintering technologies. This paper addresses a potential alternative approach to create High temperature Co-fired Ceramics (HTCC’s). Commercially pure nickel and yttria-stabilized zirconia powder layers with a controlled thickness were deposited in graphite dies using Selective Powder Deposition (SPD). These layers were subsequently pre-compacted in the die and consolidated using FAST/SPS sintering. The results show that crack-free laminates of fully dense metal and ceramic layers can be obtained. The metal sections are electrically insulated from one another, demonstrating the possibility to generate conductive tracks/circuits, while using a relatively uncomplicated deposition process and high-speed sintering.
DOI:
https://doi.org/10.59499/EP235752352