Authors:
Santiago Cano Cano (1), Paul Peritsch (1), Johannes Bosters (1), Atul Anand (2), Christian Gierl-Mayer (2), György Attila Harakály (1)
1- Incus GmbH, Austria
2- Institute of Chemical Technologies and Analytics, Research Unit of Chemical Technologies, TU Wien, Austria
Abstract:
The high thermal and electrical conductivity properties of copper position it as the optimal choice for a diverse range of electronic, electrical, and energy components. In applications like thermal management, incorporating small and intricate copper structures enhances component efficiency due to an increased surface area. Lithography-based Metal Manufacturing (LMM) facilitates the production of such geometries in a flexible and scalable manner, thereby unlocking the potential for innovative commercial copper products. Nevertheless, several challenges need to be addressed to manufacture high-quality copper components, ranging from the selection of suitable materials to ensuring stability during production and developing optimal processing parameters. This study focuses on evaluating the feedstock properties and processability of copper powders from different sources using LMM. Finally, the properties of the sintered components are measured to assess their effectiveness in thermal and electrical management applications.
DOI:
https://doi.org/10.59499/EP246281350
