Authors:
Rafik Safar Bati (Univ. Grenoble Alpes, France),
Marco Zago (Univ. Grenoble Alpes, France),
Jean-Michel Missiaen (Univ. Grenoble Alpes, France),
Didier Bouvard (Université Grenoble Alpes, France),
Jean-Marc Chaix (Univ. Grenoble Alpes, France),
Faisal Balarabe (Univ. Grenoble Alpes, France),
Yvan Avenas (Univ. Grenoble Alpes, France)
Abstract:
The interest of composite extrusion modelling (CEM) for additive manufacturing of metal components is growing up due to the low cost of this process and to the possibility of using commercial MIM feedstock. In a previous study, the successive stages of the processing route of simple copper parts have been optimised with regard to the final weight density and surface roughness. The next step has consisted in fabricating components with controlled porous architecture, to be used for cooling power electronic chips with an air flow. The thermo-hydraulic properties of these components (thermal resistance, air pressure drop) have next been measured. For future practical application of this heat sink, its bonding to a copper plate has been ensured by printing the feedstock directly upon the plate and next sintering the assembly. The shear resistance of this bonding has been found to be in line with power electronics standards.
DOI:
https://doi.org/10.59499/WP225367584